Nadca Product Specification Standards For Die Castings

J. G. (Gil) Kaufman is currently president of his consulting company, Kaufman Associates.

Semisolid metallurgy (SSM) is now some 37-years-old in terms of time from its conception and ?rst reduction to practice in the laboratory. In the intervening years, there has been a steadily growing body of research on the subject and the beginning of signi?cant industrial applications. The overall ?eld of SSM comprises today a large number of speci?c process routes, almost all of which fall in the category of either “Rheocasting” or Thi- casting.” The former begins with liquid metal and involves agitation during partial solidi?cation followed by forming. The latter begins with solid metal of suitable structure and involves heating to the desired fraction solid and forming. Research over the past 37 years, and particularly over the last decade, has provided a detailed picture of process fundamentals and led to a wide range of speci?c SSM processes and process innovations. Industrial studies and actual p- duction experience are providing a growing picture of the process advantages and limitations. At this time, the conditions for eventual wide adoption of SSM appear favorable, both for nonferrous and ferrous alloys. It must, however, be recognized that major innovations, such as SSM become adopted only slowly by industries where capital costsarehigh,pro?tmarginsaremodest,andfailuretomeetcustomercommitments carries a high penalty.

"It's about time that a practicing engineer with casting and academic experience has written a book that provides answers to questions about squeeze casting and semi-solid molding/forming that many engineers and students of casting need answered." —Joseph C. Benedyk, PhD, Consultant and retired technical director, Alcoa High Integrity Die Casting Processes provides a comprehensive look at the concepts behind advanced die casting technologies, including vacuum die casting, squeeze casting, and several variants of semi-solid metalworking. Practical applications for these processes are illustrated in numerous case studies. This single-source reference tool presents the latest material in five sections: Basic concepts of die casting and molten metal flow High integrity die casting processes with case studies Product design considerations Controlling quality and avoiding defects Future advances under development Key coverage includes a survey of liquid metal flow, strategies to overcome the limitations of conventional die casting, and potential defects unique to high integrity die casting processes. Also featured are methods for minimizing porosity, reducing cost by design, practical applied statistical process control techniques, designing for manufacturability, and containment methods for potential processing defects. Several chapters present detailed real-world examples illustrating the broad range of applications possible using high integrity die casting processes. Included with this book is a CD-ROM containing PowerPoint(r) presentations for each chapter. These presentations can be used for training purposes in conjunction with numerous study questions designed to practically apply the content of the book to real-world situations. Selected PowerPoint(r) slides can be used to support engineering proposals, marketing presentations, or customer education seminars. High Integrity Die Casting Processes is a valuable reference for both component producers and component users alike. Process engineers, tool designers, manufacturing engineers, production managers, and machine operators will acquire a better understanding of these advanced die casting processes to optimize manufacturing and improve product quality. Component designers, product engineers, purchasing agents, buyers, supplier quality engineers, and project managers will gain insight into these processes and develop superior products by design.

This book explains the design and fabrication of any electronic enclosure that contains a printed circuit board, from original design through materials selection, building and testing, and ongoing design improvement. It presents a thorough and lucid treatment of material physical properties, engineering, and compliance considerations such that readers will understand concerns that exist with a design (structural, environmental, and regulatory) and what is needed to successfully enter the marketplace. To this end, a main thrust of this volume is on the “commercialization” of electronic products when an enclosure is needed. The book targets the broadest audience tasked with design and manufacture of an enclosure for an electronic product, from mechanical/industrial engineers to designers and technicians. Compiling a wealth of information on relevant physical phenomena (strength of materials, shock and vibration, heat transfer), the book stands as a ready reference on how and where these key properties may be considered in the design of most electronic enclosures.