The Characteristics Of Dc Reactively Sputtered Aluminum Oxide Films On Silicon

The physical and electrical properties of aluminum oxide films deposited on silicon by rf sputtering from an alumina target in an argon atmosphere were investigated as a function of sputtering power density in the range from 0.5 to 3 W/sq cm. The deposition rates ranged from 20 to 80 A/min. The density, index of refraction, and dielectric constant of the films increased while the etch rate decreased with increasing power density. The surface charge at the aluminum oxide-silicon interface was typically larger than 10 to the 12th. This charge increased with increasing sputtering power density and could be reduced to 7-8 x 10 to the 11th e/sq cm by annealing. The films exhibited trapping instabilities at room temperature but no polarization was observed under biastemperature stress. The characteristics of composite layers of thermally grown silicon dioxide and sputtered aluminum oxide layers on silicon were also investigated and found to exhibit low surface charge densities, no hysteresis, and a 'contact potential' as well as charge stored at the interface between the two insulators. (Author).

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The book addresses the problem of passivation at the surface of crystalline silicon solar cells. More specifically, it reports on a high-throughput, industrially compatible deposition method for Al2O3, enabling its application to commercial solar cells. One of the main focus is on the analysis of the physics of Al2O3 as a passivating dielectric for silicon surfaces. This is accomplished through a comprehensive study, which moves from the particular, the case of aluminium oxide on silicon, to the general, the physics of surface recombination, and is able to connect theory with practice, highlighting relevant commercial applications.

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