Special Section On Polymeric Materials For Electronics Packaging

Polymeric materials are widely used during nearly all stages of the manufacturing process of electronics products and this book is intended to give an introductory overview of the chemistry, properties and uses of some of the more important classes of materials likely to be encountered in these applications. It is intended to serve primarily as an introduction to the use of polymers and plastics in the processing and manufacture of electronic and electrical components and assemblies. With no in-depth knowledge of polymers assumed, the book is ideal for engineers and researchers working in areas where electronics and polymer technology overlap. There are also numerous references for those wishing to delve deeper. The first edition of this book was published in 1985 and since then there has been an unbelievable change and growth in the electronics industry. Much of this has been made possible by the continued development of new and improved polymeric materials. In some areas the polymers used have changed markedly whereas in others there have been continued improvements to the same basic materials. Consequently, this second edition includes new chapters detailing the materials which have emerged more recently. Chapters covering the same topics as the original version have been extensively rewritten and updated, often with the assistance of current international experts. In the last few years much work has been carried out on the development and use of special polymers that have important properties in addition to those normally associated with conventional polymers. This edition therefore includes a chapter that introduces one particular group of materials exhibiting these special properties, the ferroelectric polymers. The book also includes new chapters on high temperature thermoplastics, or engineering plastics as they are sometimes known, and their use in so-called moulded interconnect devices, where the polymer is used to provide a much wider range of functions than has been possible using a more conventional approach. This new edition also has a wider international coverage with chapters by experts based in Belgium, Holland, Switzerland, Germany, England and the United States of America.

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field

POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. Polymeric Materials for Electronic Packaging readers will also find: Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

This completely revised edition remains the only comprehensive treatise on polymer coatings for electronics. Since the original edition, the applications of coatings for the environmental protection of electronic systems have greatly increased, largely driven by the competitive need to reduce costs, weight and volume. The demands for high-speed circuits for the rapid processing of signals and data, high-density circuits for the storage and retrieval of megabits of memory, and the improved reliability required of electronics for guiding and controlling weapons and space vehicles have triggered the development of many new and improved coating polymers and formulations. Both the theoretical aspects of coatings (molecular structure of polymer types and their correlation with electrical and physical properties) and applied aspects (functions, deposition processes, applications, testing) are covered in the book. Over 100 proprietary coating formulations were reviewed, their properties collated, and tables of comparative properties prepared. This book is useful as both a primer and as a handbook for collecting properties data.

From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR

Packaging materials strongly affect the effectiveness of an electronic packaging system regarding reliability, design, and cost. In electronic systems, packaging materials may serve as electrical conductors or insulators, create structure and form, provide thermal paths, and protect the circuits from environmental factors, such as moisture, contamination, hostile chemicals, and radiation. Electronic Packaging Materials and Their Properties examines the array of packaging architecture, outlining the classification of materials and their use for various tasks requiring performance over time. Applications discussed include: interconnections printed circuit boards substrates encapsulants dielectrics die attach materials electrical contacts thermal materials solders Electronic Packaging Materials and Their Properties also reviews key electrical, thermal, thermomechanical, mechanical, chemical, and miscellaneous properties as well as their significance in electronic packaging.

Commercially successful fully synthetic polymeric materials were pro duced in the early years of this century, the first example being Bakelite. This was made from phenol and formaldehyde by Leo Bakeland in 1909. Before the end of the 1920s, a large number of other synthetic polymers had been created, including polyvinyl chloride and urea-formaldehyde. Today, there are literally hundreds of synthetic polymers commercially available with ranges of properties making them suitable for applications in many industrial sectors, including the electrical and electronics industries. In many instances the driving force behind the development of new materials actually came from the electronics industry, and today's advanced electronics would be inconceivable without these materials. For many years polymers have been widely used in all sectors of the electronics industry. From the early days of the semiconductor industry to the current state of the art, polymers have provided the enabling technologies that have fuelled the inexorable and rapid development of advanced electronic and optoelectronic devices.