Recent Progress Insoldering Materials

This book is about solders and their composition and focuses on material characterizations and the methods used to make alloys and determine their structures, physical properties and applications. Physical properties and the factors that control them and theoretical verification are the main contents of this book. Corrosion of solders is included in the coverage of the properties related to solder composition and mechanical properties.

This book highlights recent research progress in lead (Pb)-free solder technology, focusing on materials development, processing, and performances. It discusses various Pb-free solder materials’ development, encompassing composite solders, transient liquid phase sintering, and alloying. The book also details various Pb-free solder technology processing and performances, including flux modification for soldering, laser soldering, wave soldering, and reflow soldering, while also examining multiple technologies pertaining to the rigid and flexible printed circuit board (PCB). Some chapters explain the materials characterization and modeling techniques using computational fluid dynamics (CFD). This book serves as a valuable reference for researchers, industries, and stakeholders in advanced microelectronic packaging, emerging interconnection technology, and those working on Pb-free solder.

Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn’t work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You’ll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.

This book presents peer reviewed articles from the Green Materials and Electronic Packaging Interconnect Technology Symposium, (EPITS 2022), held in Langkawi, Malaysia on 14th and 15th of Sept, 2022. It brings together packaging experts to share and exchange ideas in electronics technology. Topics covered in this volume include, but are not limited to; (1) Green materials and technology, (2) Emerging interconnect materials and technologies,(3) Non-solder interconnect materials at chip and package levels, (4) Fundamental materials behavior for electronic packaging materials, (5) Advanced characterization methods as applied to electronic packaging technology, (6) Developments in high temperature Pb-free solders and associated interconnects for automotive and power electronics, (7) Surface coating materials & (8) Advanced materials. ​

This book explores the outcomes on flow control research activities carried out within the framework of two EU-funded projects focused on training-through-research of Marie Sklodowska-Curie doctoral students. The main goal of the projects described in this monograph is to assess the potential of the passive- and active-flow control methods for reduction of fuel consumption by a helicopter. The research scope encompasses the fields of structural dynamics, fluid flow dynamics, and actuators with control. Research featured in this volume demonstrates an experimental and numerical approach with a strong emphasis on the verification and validation of numerical models. The book is ideal for engineers, students, and researchers interested in the multidisciplinary field of flow control.

Joining Processes for Dissimilar and Advanced Materials describes how to overcome the many challenges involved in the joining of similar and dissimilar materials resulting from factors including different thermal coefficients and melting points. Traditional joining processes are ineffective with many newly developed materials. The ever-increasing industrial demands for production efficiency and high-performance materials are also pushing this technology forward. The resulting emergence of advanced micro- and nanoscale material joining technologies, have provided many solutions to these challenges. Drawing on the latest research, this book describes primary and secondary processes for the joining of advanced materials such as metals and alloys, intermetallics, ceramics, glasses, polymers, superalloys, electronic materials and composites in similar and dissimilar combinations. It also covers details of joint design, quality assurance, economics and service life of the product. Provides valuable information on innovative joining technologies including induction heating of metals, ultrasonic heating, and laser heating at micro- and nanoscale levels Describes the newly developed modelling, simulation and digitalization of the joining process Includes a methodology for characterization of joints

The Chapter deals with solderability of ceramic materials by ultrasound and suitable selection of soldering alloy. The solderability issue of ceramic materials consists mainly in the fact that the ceramic materials are not wettable by the common solders, due to their ionic and covalent bond between the atoms. However, there exist several ways to ensure the wettability of ceramic material surface. One of them is for example coating of ceramic material by a metallic layer. Anyway, a more perspective solution seems to be the application of soldering alloys which are alloyed with a small amount of alloying elements which exert high affinity to some component of ceramic material. The basic group of such solders are the so-called active solders containing from 1 to 5 wt. % Ti. Another group of solders, which may wet the ceramic material, are the solders alloyed with a small amount of lanthanides, for example La, Ce et cetera The content of lanthanides varies from 0.5 up to 2 wt. %. The last group consists of the solders containing indium in the amount from 20 to 100 wt. %. The aim of study was to compare these three groups of soldering alloys from the viewpoint of mechanism of bond formation. The interactions between the solder and ceramic substrate were analysed and shear strength of fabricated soldered joint was determined. To improve the solderability, the soldering in combination with an active power ultrasound was also employed.

Sustainable development is a globally recognized mandate and it includes green or environment-friendly manufacturing practices. Such practices orchestrate with the self-healing and self-replenishing capability of natural ecosystems. Green manufacturing encompasses synthesis, processing, fabrication, and process optimization, but also testing, performance evaluation and reliability. The book shall serve as a comprehensive and authoritative resource on sustainable manufacturing of ceramics, metals and their composites. It is designed to capture the diversity and unity of methods and approaches to materials processing, manufacturing, testing and evaluation across disciplines and length scales. Each chapter incorporates in-depth technical information without compromising the delicate link between factual data and fundamental concepts or between theory and practice. Green and sustainable materials processing and manufacturing is designed as a key enabler of sustainable development. A one-stop compendium of new research and technology of green manufacturing of metals, ceramics and their composites In-depth cutting-edge treatment of synthesis, processing, fabrication, process optimization, testing, performance evaluation and reliability which are of critical importance to green manufacturing Stimulates fresh thinking and exchange of ideas and information on approaches to green materials processing across disciplines

Get the latest developments in solder technology You can't work in electronics without solder -- and you shouldn't work with solder without Solders and Soldering, Fourth Edition. Profusely illustrated, this book by the world's top solder educator has been the leader in its field for two decades. You'll learn 29 different methods for soldering and heating (for both automatic and manual procedures), and learn about the strengths and weaknesses of each method for varying applications. This up-to-date edition deals at length with modern cleaning materials and processes, emphasizing EPA and OSHA guidelines and regulations, and provides you with state-of-the-art techniques for soldering with miniaturized circuit boards.

This book provides a comprehensive overview of important aspects of solder materials including solderability and soldering reaction, physical metallurgy, mechanical properties, electromigration, and reliability of solder joint. The scope of this book covers mainly, but not limited to, the important research achievements of all the subjects having been disclosed and discussed in the literatures. It is a very informative book for those who are interested in learning the material properties of solders, carrying out fundamental research, and in carrying out practical applications. This book is an important resource for the various important subjects relating to solder materials.