Proceedings of the 2001 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2001

Proceedings of the 2001 8th International Symposium on the Physical & Failure Analysis of Integrated Circuits : IPFA 2001
Author: Wilson Tan
Publisher: Institute of Electrical & Electronics Engineers(IEEE)
Total Pages: 262
Release: 2001
Genre: Technology & Engineering
ISBN: 9780780366756


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This volume contains the conference proceedings of the 2001 8th International Symposium on the Physical and Failure Analysis of Integrated Circuits.

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis

ISTFA 2019: Proceedings of the 45th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
Total Pages: 540
Release: 2019-12-01
Genre: Technology & Engineering
ISBN: 1627082735


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The theme for the 2019 conference is Novel Computing Architectures. Papers will include discussions on the advent of Artificial Intelligence and the promise of quantum computing that are driving disruptive computing architectures; Neuromorphic chip designs on one hand, and Quantum Bits on the other, still in R&D, will introduce new computing circuitry and memory elements, novel materials, and different test methodologies. These novel computing architectures will require further innovation which is best achieved through a collaborative Failure Analysis community composed of chip manufacturers, tool vendors, and universities.

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis

ISTFA 2018: Proceedings from the 44th International Symposium for Testing and Failure Analysis
Author:
Publisher: ASM International
Total Pages:
Release: 2018-12-01
Genre:
ISBN: 1627080996


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The International Symposium for Testing and Failure Analysis (ISTFA) 2018 is co-located with the International Test Conference (ITC) 2018, October 28 to November 1, in Phoenix, Arizona, USA at the Phoenix Convention Center. The theme for the November 2018 conference is "Failures Worth Analyzing." While technology advances fast and the market demands the latest and the greatest, successful companies strive to stay competitive and remain profitable.

Silicon-on-Insulator Technology: Materials to VLSI

Silicon-on-Insulator Technology: Materials to VLSI
Author: J.-P. Colinge
Publisher: Springer Science & Business Media
Total Pages: 375
Release: 2012-12-06
Genre: Technology & Engineering
ISBN: 1441991069


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Silicon-on-Insulator Technology: Materials to VLSI, Third Edition, retraces the evolution of SOI materials, devices and circuits over a period of roughly twenty years. Twenty years of progress, research and development during which SOI material fabrication techniques have been born and abandoned, devices have been invented and forgotten, but, most importantly, twenty years during which SOI Technology has little by little proven it could outperform bulk silicon in every possible way. The turn of the century turned out to be a milestone for the semiconductor industry, as high-quality SOI wafers suddenly became available in large quantities. From then on, it took only a few years to witness the use of SOI technology in a wealth of applications ranging from audio amplifiers and wristwatches to 64-bit microprocessors. This book presents a complete and state-of-the-art review of SOI materials, devices and circuits. SOI fabrication and characterization techniques, SOI CMOS processing, and the physics of the SOI MOSFET receive an in-depth analysis.

Istfa 2005

Istfa 2005
Author: ASM International
Publisher: ASM International
Total Pages: 524
Release: 2005-01-01
Genre: Technology & Engineering
ISBN: 1615030883


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ISTFA 2010

ISTFA 2010
Author:
Publisher: ASM International
Total Pages: 487
Release: 2010-01-01
Genre: Technology & Engineering
ISBN: 1615037276


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