Polymeric Materials For Electronic Packaging

POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. Polymeric Materials for Electronic Packaging readers will also find: Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

The most recent advances in the use of polymeric materials by the electronic industry can be found in Polymers for Electronic and Photonic Applications. This bookprovides in-depth coverage of photoresis for micro-lithography, microelectronic encapsulants and packaging, insulators, dielectrics for multichip packaging,electronic and photonic applications of polymeric materials, among many other topics. Intended for engineers and scientists who design, process, and manufacturemicroelectronic components, this book will also prove useful for hybrid and systems packaging managers who want to be informed of the very latest developments inthis field. * Presents most recent advances in the use of polymeric materials by the electronic industry* Contributions by foremost experts in the field

POLYMERIC MATERIALS FOR ELECTRONIC PACKAGING Create and deploy reliable polymeric materials for use in electronic products with this comprehensive guide Modern electronic products are manufactured at a finer scale and with more precision than ever before. This places increasing demand on the proper use and management of high-performance polymers to create reliable, rapidly-operating semiconductor products. Understanding the physical properties and viscoelasticity analysis of resins is essential for engineers and researchers to perfect and deploy these polymers in electronics contexts. Polymeric Materials for Electronic Packaging is designed to meet this specific need with a thorough introduction to these materials and their production. It provides the tools engineers need to reduce processing times and increase durability in their semiconductor packages and products. Translated from the Japanese original and offering in-depth analysis from a global-leading expert, this promises to be an indispensable volume. Polymeric Materials for Electronic Packaging readers will also find: Detailed treatment of subjects including viscoelastic theory, design issues of LSI packages, and more Analysis uniquely suited to the dimensions of cutting-edge semiconductor technology Incorporation of cutting-edge viscoelasticity analysis software, available separately from the author Polymeric Materials for Electronic Packaging is critical for electrical and electronics engineers working with semiconductors, as well as advanced postgraduate students and researchers in this or numerous related areas.

From a symposium of the ACS 196th meeting, Los Angeles, CA, Sept. 1988. Thirty-nine chapters cover a broad spectrum of topics in four general areas: physical chemistry of materials, properties and applications of encapsulants and gels, and printed circuit board substrates and materials. Also includes a review of the marketing trends which drive packaging technology. Annotation copyrighted by Book News, Inc., Portland, OR

This book covers recent advancements in the field of polymer science and technology. Frontiers areas, such as polymers based on bio-sources, polymer based ferroelectrics, polymer nanocomposites for capacitors, food packaging and electronic packaging, piezoelectric sensors, polymers from renewable resources, superhydrophobic materials and electrospinning are topics of discussion. The contributors to this book are expert researchers from various academic institutes and industries from around the world.

The object of this book is to review and to discuss some important applications of polymers in electronics. The first three chapters discuss the current primary applications of polymers in semiconductor device manufacturing: polymers as resist materials for integrated circuit fabrication, polyimides as electronics packaging materials, and polymers as integrated circuits encapsulates.

The need for advanced thermal management materials in electronic packaging has been widely recognized as thermal challenges become barriers to the electronic industry’s ability to provide continued improvements in device and system performance. With increased performance requirements for smaller, more capable, and more efficient electronic power devices, systems ranging from active electronically scanned radar arrays to web servers all require components that can dissipate heat efficiently. This requires that the materials have high capability of dissipating heat and maintaining compatibility with the die and electronic packaging. In response to critical needs, there have been revolutionary advances in thermal management materials and technologies for active and passive cooling that promise integrable and cost-effective thermal management solutions. This book meets the need for a comprehensive approach to advanced thermal management in electronic packaging, with coverage of the fundamentals of heat transfer, component design guidelines, materials selection and assessment, air, liquid, and thermoelectric cooling, characterization techniques and methodology, processing and manufacturing technology, balance between cost and performance, and application niches. The final chapter presents a roadmap and future perspective on developments in advanced thermal management materials for electronic packaging.