Metal Induced Crystallization Of Amorphous Carbon

Crystalline semiconductors in the form of thin films are crucial materials for many modern, advanced technologies in fields such as microelectronics, optoelectronics, display technology, and photovoltaic technology. Crystalline semiconductors can be produced at surprisingly low temperatures (as low as 120C) by crystallization of amorphous semicon

World experts in amorphous carbon have been drawn together to produce this comprehensive commentary on the current state and future prospects of amorphous carbon, a highly functional material. Amorphous carbon has a wide range of properties that are primarily controlled by the different bond hybridisations possible in such materials. This allows for the growth of an extensive range of thin films that can be tailored for specific applications. Films can range from those with high transparency and which are hard and diamond-like, through to those which are opaque, soft and graphitic-like. Application areas including field emission cathodes, MEMs, electronic devices, medical and optical coatings are now close to market.

Amorphous, hydrogenated carbon (AHC) films can be deposited on various substrates using several techniques, e.g. plasma deposition and ion beam deposition. The resulting films can be hard, wear resistant and transparent.

Tribology of Polymeric Nanocomposites provides a comprehensive description of polymeric nanocomposites, both as bulk materials and as thin surface coatings, and provides rare, focused coverage of their tribological behavior and potential use in tribological applications. Providing engineers and designers with the preparation techniques, friction and wear mechanisms, property information and evaluation methodology needed to select the right polymeric nanocomposites for the job, this unique book also includes valuable real-world examples of polymeric nanocomposites in action in tribological applications. Provides a complete reference to polmer nanocomposite material use in tribology from preparation through to selection and use Explains the theory through examples of real-world applications, keeping this high-level topic practical and accessible Includes contributions from more than 20 international tribology experts to offer broad yet detailed coverage of this fast-moving field

Present-day scienceand technology have become increasingly based on studies and applications of thin films. This is especiallytrue of solid-state physics, semiconduc tor electronics, integrated optics, computer science, and the like. In these fields, it is necessary to use filmswith an ordered structure, especiallysingle-crystallinefilms, because physical phenomena and effects in such films are most reproducible. Also, active parts of semiconductor and other devices and circuits are created, as a rule, in single-crystal bodies. To date, single-crystallinefilms have been mainly epitaxial (or heteroepitaxial); i.e., they have been grown on a single-crystalline substrate, and principal trends, e.g., in the evolution of integrated circuits (lCs), have been based on continuing reduction in feature size and increase in the number of components per chip. However, as the size decreases into the submicrometer range, technological and physical limitations in integrated electronics become more and more severe. It is generally believed that a feature size of about 0.1um will have a crucial character. In other words, the present two-dimensional ICs are anticipated to reach their limit of minimization in the near future, and it is realized that further increase of packing density and/or functions might depend on three-dimensional integration. To solve the problem, techniques for preparation of single-crystalline films on arbitrary (including amorphous) substrates are essential.

FIB Nanostructures reviews a range of methods, including milling, etching, deposition, and implantation, applied to manipulate structures at the nanoscale. Focused Ion Beam (FIB) is an important tool for manipulating the structure of materials at the nanoscale, and substantially extends the range of possible applications of nanofabrication. FIB techniques are widely used in the semiconductor industry and in materials research for deposition and ablation, including the fabrication of nanostructures such as nanowires, nanotubes, nanoneedles, graphene sheets, quantum dots, etc. The main objective of this book is to create a platform for knowledge sharing and dissemination of the latest advances in novel areas of FIB for nanostructures and related materials and devices, and to provide a comprehensive introduction to the field and directions for further research. Chapters written by leading scientists throughout the world create a fundamental bridge between focused ion beam and nanotechnology that is intended to stimulate readers' interest in developing new types of nanostructures for application to semiconductor technology. These applications are increasingly important for the future development of materials science, energy technology, and electronic devices. The book can be recommended for physics, electrical engineering, and materials science departments as a reference on materials science and device design.

This book presents the status quo of the structure, preparation, properties and applications of tetrahedrally bonded amorphous carbon (ta-C) films and compares them with related film systems. Tetrahedrally bonded amorphous carbon films (ta-C) combine some of the outstanding properties of diamond with the versatility of amorphous materials. The book compares experimental results with the predictions of theoretical analyses, condensing them to practicable rules. It is strictly application oriented, emphasizing the exceptional potential of ta-C for tribological coatings of tools and components.

Rapidly Quenched Metals, Volume I covers the proceedings of the Fifth International Conference on Rapidly Quenched Metals, held in Wurzburg, Germany on September 3-7, 1984. The book focuses on amorphous and crystalline metals formed by rapid quenching from the melt. The selection first covers the scope and trends of developments in rapid solidification technology, rapid solidification, and undercooling of liquid metals by rapid quenching. Discussions focus on experimental method, powders, strip, particulate production, consolidation, and alloys and alloy systems. The text then examines the solidification of undercooled liquid alloys entrapped in solid; crystallization kinetics in undercooled droplets; and grain refinement in bulk undercooled alloys. The manuscript tackles the undercooling of niobium-germanium alloys in a 100 meter drop tube; influence of process parameters on the cooling rate of the meltspinning process; and the mechanism of ribbon formation in melt-spun copper and copper-zirconium. The formation and structure of thick sections of rapidly-solidified material by incremental deposition and production of ultrafine dispersions of rare earth oxides in Ti alloys using rapid solidification are also mentioned. The selection is a valuable reference for physicists, chemists, physical metallurgists, and engineers.