Low Power Noc For High Performance Soc Design

Chip Design and Implementation from a Practical Viewpoint Focusing on chip implementation, Low-Power NoC for High-Performance SoC Design provides practical knowledge and real examples of how to use network on chip (NoC) in the design of system on chip (SoC). It discusses many architectural and theoretical studies on NoCs, including design methodology, topology exploration, quality-of-service guarantee, low-power design, and implementation trials. The Steps to Implement NoC The book covers the full spectrum of the subject, from theory to actual chip design using NoC. Employing the Unified Modeling Language (UML) throughout, it presents complicated concepts, such as models of computation and communication–computation partitioning, in a manner accessible to laypeople. The authors provide guidelines on how to simplify complex networking theory to design a working chip. In addition, they explore the novel NoC techniques and implementations of the Basic On-Chip Network (BONE) project. Examples of real-time decisions, circuit-level design, systems, and chips give the material a real-world context. Low-Power NoC and Its Application to SoC Design Emphasizing the application of NoC to SoC design, this book shows how to build the complicated interconnections on SoC while keeping a low power consumption.

Addresses the Challenges Associated with System-on-Chip Integration Network-on-Chip: The Next Generation of System-on-Chip Integration examines the current issues restricting chip-on-chip communication efficiency, and explores Network-on-chip (NoC), a promising alternative that equips designers with the capability to produce a scalable, reusable, and high-performance communication backbone by allowing for the integration of a large number of cores on a single system-on-chip (SoC). This book provides a basic overview of topics associated with NoC-based design: communication infrastructure design, communication methodology, evaluation framework, and mapping of applications onto NoC. It details the design and evaluation of different proposed NoC structures, low-power techniques, signal integrity and reliability issues, application mapping, testing, and future trends. Utilizing examples of chips that have been implemented in industry and academia, this text presents the full architectural design of components verified through implementation in industrial CAD tools. It describes NoC research and developments, incorporates theoretical proofs strengthening the analysis procedures, and includes algorithms used in NoC design and synthesis. In addition, it considers other upcoming NoC issues, such as low-power NoC design, signal integrity issues, NoC testing, reconfiguration, synthesis, and 3-D NoC design. This text comprises 12 chapters and covers: The evolution of NoC from SoC—its research and developmental challenges NoC protocols, elaborating flow control, available network topologies, routing mechanisms, fault tolerance, quality-of-service support, and the design of network interfaces The router design strategies followed in NoCs The evaluation mechanism of NoC architectures The application mapping strategies followed in NoCs Low-power design techniques specifically followed in NoCs The signal integrity and reliability issues of NoC The details of NoC testing strategies reported so far The problem of synthesizing application-specific NoCs Reconfigurable NoC design issues Direction of future research and development in the field of NoC Network-on-Chip: The Next Generation of System-on-Chip Integration covers the basic topics, technology, and future trends relevant to NoC-based design, and can be used by engineers, students, and researchers and other industry professionals interested in computer architecture, embedded systems, and parallel/distributed systems.

Abstract: Network-on-Chip (NoC) communication architectures have been recognized as the most scalable and efficient solution for on chip communication challenges in the multi-core era. Diverse demanding applications coupled with the ability to integrate billions of transistors on a single chip are some of the main driving forces behind ever increasing performance requirements towards the level that requires several tens to over a hundred of cores per chip. Small scale multicore processors so far have been a great commercial success and found applicability in many applications. Systems using multi-core processors are now the norm rather than the exception. As the number of cores or components integrated into a single system is keep increasing, the design of on-chip communication architecture is becoming more challenging. The increasing number of components in a system translates into more inter-component communication that must be handled by the on-chip communication infrastructure. Future system-on-chip (SoC) designs require predictable, scalable and reusable on-chip communication architectures to increase reliability and productivity. Current bus-based interconnect architectures are inherently non-scalable, less adaptable for reuse and their reliability decreases with system size. NoC communication guarantees scalability, high-speed, high-bandwidth communication with minimal wiring overhead and routing issues. NoCs are layered, packet-based on-chip communication networks integrated onto a single chip. NoC consists of resources and switches that are directly connected in a way that resources are able to communicate with each other by sending messages. The proficiency of a NoC to meet its design goals and budget requirements for the target application depends on its design. Often, these design goals conflict and trade-off with each other. The multi-dimensional pull of design constraints in addition to technology scaling complicates the process of NoC design in many aspects, as they are expected to support high performance and reliability along with low cost, smaller area, less time-to-market and lower power consumption. To aid in the process, this research presents design methodologies to achieve low power and high performance NoC communication architectures for nanometer SoCs.

This book explores up-to-date research trends and achievements on low-power and high-speed technologies in both electronics and optics. It offers unique insight into low-power and high-speed approaches ranging from devices, ICs, sub-systems and networks that can be exploited for future mobile devices, 5G networks, Internet of Things (IoT), and data centers. It collects heterogeneous topics in place to catch and predict future research directions of devices, circuits, subsystems, and networks for low-power and higher-speed technologies. Even it handles about artificial intelligence (AI) showing examples how AI technology can be combined with concurrent electronics. Written by top international experts in both industry and academia, the book discusses new devices, such as Si-on-chip laser, interconnections using graphenes, machine learning combined with CMOS technology, progresses of SiGe devices for higher-speed electronices for optic, co-design low-power and high-speed circuits for optical interconnect, low-power network-on-chip (NoC) router, X-ray quantum counting, and a design of low-power power amplifiers. Covers modern high-speed and low-power electronics and photonics. Discusses novel nano-devices, electronics & photonic sub-systems for high-speed and low-power systems, and many other emerging technologies like Si photonic technology, Si-on-chip laser, low-power driver for optic device, and network-on-chip router. Includes practical applications and recent results with respect to emerging low-power systems. Addresses the future perspective of silicon photonics as a low-power interconnections and communication applications.

In Interconnect-centric Design for Advanced SoC and NoC, we have tried to create a comprehensive understanding about on-chip interconnect characteristics, design methodologies, layered views on different abstraction levels and finally about applying the interconnect-centric design in system-on-chip design. Traditionally, on-chip communication design has been done using rather ad-hoc and informal approaches that fail to meet some of the challenges posed by next-generation SOC designs, such as performance and throughput, power and energy, reliability, predictability, synchronization, and management of concurrency. To address these challenges, it is critical to take a global view of the communication problem, and decompose it along lines that make it more tractable. We believe that a layered approach similar to that defined by the communication networks community should also be used for on-chip communication design. The design issues are handled on physical and circuit layer, logic and architecture layer, and from system design methodology and tools point of view. Formal communication modeling and refinement is used to bridge the communication layers, and network-centric modeling of multiprocessor on-chip networks and socket-based design will serve the development of platforms for SoC and NoC integration. Interconnect-centric Design for Advanced SoC and NoC is concluded by two application examples: interconnect and memory organization in SoCs for advanced set-top boxes and TV, and a case study in NoC platform design for more generic applications.

Now in a thoroughly revised second edition, this practical practitioner guide provides a comprehensive overview of the SoC design process. It explains end-to-end system on chip (SoC) design processes and includes updated coverage of design methodology, the design environment, EDA tool flow, design decisions, choice of design intellectual property (IP) cores, sign-off procedures, and design infrastructure requirements. The second edition provides new information on SOC trends and updated design cases. Coverage also includes critical advanced guidance on the latest UPF-based low power design flow, challenges of deep submicron technologies, and 3D design fundamentals, which will prepare the readers for the challenges of working at the nanotechnology scale. A Practical Approach to VLSI System on Chip (SoC) Design: A Comprehensive Guide, Second Edition provides engineers who aspire to become VLSI designers with all the necessary information and details of EDA tools. It will be a valuable professional reference for those working on VLSI design and verification portfolios in complex SoC designs

This book presents the state-of-the art of one of the main concerns with microprocessors today, a phenomenon known as "dark silicon". Readers will learn how power constraints (both leakage and dynamic power) limit the extent to which large portions of a chip can be powered up at a given time, i.e. how much actual performance and functionality the microprocessor can provide. The authors describe their research toward the future of microprocessor development in the dark silicon era, covering a variety of important aspects of dark silicon-aware architectures including design, management, reliability, and test. Readers will benefit from specific recommendations for mitigating the dark silicon phenomenon, including energy-efficient, dedicated solutions and technologies to maximize the utilization and reliability of microprocessors.

This book provides a practical guide for engineers doing low power System-on-Chip (SoC) designs. It covers various aspects of low power design from architectural issues and design techniques to circuit design of power gating switches. In addition to providing a theoretical basis for these techniques, the book addresses the practical issues of implementing them in today's designs with today's tools.

The first book to explain the principals behind mobile 3D hardware implementation, helping readers understand advanced algorithms, produce low-cost, low-power SoCs, or become familiar with embedded systems As mobile broadcasting and entertainment applications evolve, there is increasing interest in 3D graphics within the field of mobile electronics, particularly for handheld devices. In Mobile 3D Graphics SoC, Yoo provides a comprehensive understanding of the algorithms of mobile 3D graphics and their real chip implementation methods. 3D graphics SoC (System on a Chip) architecture and its interaction with embedded system software are explained with numerous examples. Yoo divides the book into three sections: general methodology of low power SoC, design of low power 3D graphics SoC, and silicon implementation of 3D graphics SoCs and their application to mobile electronics. Full examples are presented at various levels such as system level design and circuit level optimization along with design technology. Yoo incorporates many real chip examples, including many commercial 3D graphics chips, and provides cross-comparisons of various architectures and their performance. Furthermore, while advanced 3D graphics techniques are well understood and supported by industry standards, this is less true in the emerging mobile applications and games market. This book redresses this imbalance, providing an in-depth look at the new OpenGL ES (The Standard for Embedded Accelerated 3D Graphics), and shows what these new embedded systems graphics libraries can provide for 3D graphics and games developers.

Low Power Circuit Design Using Advanced CMOS Technology is a summary of lectures from the first Advanced CMOS Technology Summer School (ACTS) 2017. The slides are selected from the handouts, while the text was edited according to the lecturers talk.ACTS is a joint activity supported by the IEEE Circuit and System Society (CASS) and the IEEE Solid-State Circuits Society (SSCS). The goal of the school is to provide society members as well researchers and engineers from industry the opportunity to learn about new emerging areas from leading experts in the field. ACTS is an example of high-level continuous education for junior engineers, teachers in academe, and students. ACTS was the results of a successful collaboration between societies, the local chapter leaders, and industry leaders. This summer school was the brainchild of Dr. Zhihua Wang, with strong support from volunteers from both the IEEE SSCS and CASS. In addition, the local companies, Synopsys China and Beijing IC Park, provided support.This first ACTS was held in the summer 2017 in Beijing. The lectures were given by academic researchers and industry experts, who presented each 6-hour long lectures on topics covering process technology, EDA skill, and circuit and layout design skills. The school was hosted and organized by the CASS Beijing Chapter, SSCS Beijing Chapter, and SSCS Tsinghua Student Chapter. The co-chairs of the first ACTS were Dr. Milin Zhang, Dr. Hanjun Jiang and Dr. Liyuan Liu. The first ACTS was a great success as illustrated by the many participants from all over China as well as by the publicity it has been received in various media outlets, including Xinhua News, one of the most popular news channels in China.