High Performance Printed Circuit Boards

Printed circuit boards (PCBs) and ceramic substrates are the baseline on which almost all modern microelectronics are mounted. The increase in complexity of high performance microelectronics has put great stress on PCB technologies - this volume provides data and design information for the new generation fast, dense boards and substrates. It covers microvias, built-up multilayers, and high density boards; advanced ceramic substrates; and environmentally-safe materials.

Select PCB materials for top performing boards. From weaving glass fiber mats to testing finished boards, this materials database offers close-up look at how to process and fabricate PCBs. It gives you hands-on working knowledge of the electrical, mechanical and physical properties of PCB raw materials.

This leading-edge circuit design resource offers the knowledge needed to quickly pinpoint transmission problems that can compromise circuit design. Discusses both design and debug issues at gigabit per second data rates.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modeling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. Key Features: Develops an in-depth understanding of high-frequency (GHz) EMC problems from the behavior of the electric and magnetic fields instead of the voltage and current, Analyzes the electromagnetic modal field distribution in highspeed circuits, providing an easy-access way for people without a strong electromagnetic background to better understand obscure electromagnetic field behaviors, Provides "know how" to practical EMC engineers for their EMC designs through the field-circuit hybrid method, Presents the recent development of electromagnetic modeling of the through silicon via (TSV) based three-dimensional packaging, Includes the recent applications of novel materials technology on the traditional EMC design, This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications. Book jacket.

Modeling and Design of Electromagnetic Compatibility for High-Speed Printed Circuit Boards and Packaging presents the electromagnetic modelling and design of three major electromagnetic compatibility (EMC) issues related to the high-speed printed circuit board (PCB) and electronic packages: signal integrity (SI), power integrity (PI), and electromagnetic interference (EMI). The emphasis is put on two essential passive components of PCBs and packages: the power distribution network and the signal distribution network. This book includes two parts. Part one talks about the field-circuit hybrid methods used for the EMC modeling, including the modal method, the integral equation method, the cylindrical wave expansion method and the de-embedding method. Part two illustrates EMC design methods and explores the applications of novel metamaterials and two-dimensional materials on traditional EMC problems. This book is designed to enhance worthwhile electromagnetic theory and mathematical methods for practical engineers and to train students with advanced EMC applications.

Focused on the field of knowledge lying between digital and analog circuit theory, this new text will help engineers working with digital systems shorten their product development cycles and help fix their latest design problems. The scope of the material covered includes signal reflection, crosstalk, and noise problems which occur in high speed digital machines (above 10 megahertz). This volume will be of practical use to digital logic designers, staff and senior communications scientists, and all those interested in digital design.

Complicated concepts explained succinctly and in laymen's terms to both experienced and novice PCB designers. Numerous examples allow reader to visualize how high-end software simulators see various types of SI problems and then their solutions. Author is a frequent and recognized seminar leader in the industry.

The printed circuit is the basic building block of the electronics hardware industry. This is a comprehensive single volume self-teaching guide to the art of printed circuit board design and fabrication -- covering the complete cycle of PCB creation, design, layout, fabrication, assembly, and testing.

As circuit boards are increasingly required to transmit signals at higher and higher speeds, signal and power integrity become increasingly crucial. Rules of thumb that you have used over and over again to prevent signal loss no longer apply to these new, high-speed, high-density circuit designs. This leading-edge circuit design resource offers you the knowledge needed to quickly pinpoint transmission problems that can compromise your entire circuit design. Discussing both design and debug issues at gigabit per second data rates, the book serves as a practical reference for your projects involving high-speed serial signaling on printed wiring boards.