Crosstalk Between Microstrip Transmission Lines

In chapters culled from the popular and critically acclaimed Electromagnetic Compatibility Handbook, Transmission Lines, Matching, and Crosstalk provides a tightly focused, convenient, and affordable reference for those interested primarily in this subset of topics. Author Kenneth L. Kaiser demystifies transmission lines, matching, and crosstalk and explains the source and limitations of the approximations, guidelines, models, and rules-of-thumb used in this field. The material is presented in a unique question-and-answer format that gets straight to the heart of each topic. The book includes numerous examples and uses Mathcad to generate all of the figures and many solutions to equations. In many cases, the entire Mathcad program is provided.

In this report the problem of propagation of high speed pulses is considered. The purpose of this analysis is to investigate effects such as RC delays, reflection cross-coupling or cross talk, etc. in coupled microstrip lines. Two-, three-, and coupled N-line configurations are considered under various conditions of terminations. Keywords include: High speed Digital Circuits; Pulse Propagation; Coupled Microstrip Lines; and Cross Talk.

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

An important concern for high speed circuit designs is that of crosstalk and electromagnetic interference. In PCB board-level designs, crosstalk at microwave frequencies may result from imperfections in shielding of PCB interconnects or more generally transmission lines. Several studies have been done to characterize and improve the isolation between PCB transmission lines for both digital and RF circuits. For example, previous studies in the microwave region have examined the effect that line type, line length, and separation have on crosstalk and suggest that without full shielding, the upper limit of isolation is on the order of 60dB for traditional board-level lines [1]. In order to more fully characterize crosstalk and improve isolation above 60 dB, this thesis studies signal-to-ground-plane separation, considers advanced line types, and examines the effect of 3D shielding. Results are presented from 100MHz to 30GHz for the traditional transmission line structures of microstrip, CPW, differential pair and CPW differential pair. This study shows that with a halving of distance between signal and ground planes, isolation between transmission lines can be reduced by as much as 20dB, making this one of the best ways to improve performance. Advanced methods of shielding are then presented. Direct launch stripline and single-sided CPW improve upon existing crosstalk reduction techniques, while split shielding and ablation of dielectric PCB material are also proposed. The data and additional crosstalk reduction techniques discussed in this thesis serve two purposes. One: with a more complete understanding of the effects that transmission line types and parameters have on crosstalk, engineers can quickly identify potential crosstalk issues and resolve them before manufacturing. Second, this thesis presents the engineer with four new additional techniques that may become available in advanced manufacturing environments. Such techniques can further reduce crosstalk and may allow for isolation values to approach 100 dB at the PC board level.

In the last 30 years there have been dramatic changes in electrical technology--yet the length of the undergraduate curriculum has remained four years. Until some ten years ago, the analysis of transmission lines was a standard topic in the EE and CpE undergraduate curricula. Today most of the undergraduate curricula contain a rather brief study of the analysis of transmission lines in a one-semester junior-level course on electromagnetics. In some schools, this study of transmission lines is relegated to a senior technical elective or has disappeared from the curriculum altogether. This raises a serious problem in the preparation of EE and CpE undergraduates to be competent in the modern industrial world. For the reasons mentioned above, today's undergraduates lack the basic skills to design high-speed digital and high-frequency analog systems. It does little good to write sophisticated software if the hardware is unable to process the instructions. This problem will increase as the speeds and frequencies of these systems continue to increase seemingly without bound. This book is meant to repair that basic deficiency.