Creep Of Engineering Materials And Structures

Volume is indexed by Thomson Reuters CPCI-S (WoS). Recent research on the creep and fracture of engineering materials is presented, with particular emphasis being placed on: mechanisms of high-temperature deformation and fracture, materials for high-temperature service, the behavior of single and polycrystals, components and structures, grain boundaries and interfaces, and superplasticity.

This book develops methods to simulate and analyze the time-dependent changes of stress and strain states in engineering structures up to the critical stage of creep rupture. The objective of this book is to review some of the classical and recently proposed approaches to the modeling of creep for structural analysis applications. It also aims to extend the collection of available solutions of creep problems by new, more sophisticated examples.