Coupling Reduction Using Electromagnetic Band Gap Structures In Enclosures And Cavities

An essential guide to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links Written by a team of experts in the field, Electromagnetic Bandgap (EBG) Structures explores the practical electromagnetic bandgap based common mode filters for power integrity applications and covers the theoretical and practical design approaches for common mode filtering in high-speed printed circuit boards, especially for boards in high data-rate systems. The authors describe the classic applications of electromagnetic bandgap (EBG) structures and the phenomena of common mode generation in high speed digital boards. The text also explores the fundamental electromagnetic mechanisms of the functioning of planar EBGs and considers the impact of planar EBGs on the digital signal propagation of single ended and differential interconnects routed on top or between EBGs. The authors examine the concept, design, and modeling of EBG common mode filters in their two forms: on-board and removable. They also provide several comparisons between measurement and electromagnetic simulations that validate the proposed EBG filters' design approach. This important resource: • Presents information on planar EBG based common mode filters for high speed differential digital systems • Provides systematic analysis of the fundamental mechanisms of planar EBG structures • Offers detailed design methodology to create EBG filters without the need for repeated full-wave electromagnetic analysis • Demonstrates techniques for use in practical real-world designs Electromagnetic Bandgap (EBG) Structures: Common Mode Filters for High Speed Digital Systems offers an introduction to the background, design, and application of common-mode filtering structures in modern high-speed differential communication links, a critical issue in high-speed and high-performance systems.

This book is a reference for researchers who want to learn about resonant periodic structures for applications in microstrip circuits. The readers can learn simple methods to analyze these structures using commercially available software and equivalent circuit modelling. The application examples demonstrated in the book will open up new research ideas in this field.

This exciting new book focuses on the analysis and design of reconfigurable antennas for modern wireless communications, sensing, and radar. It presents the definitions of basic antenna parameters, an overview of RF switches and explains how to characterize their insertion loss, isolation, and power handling issues. Basic reconfigurable antenna building blocks, such as dipoles, monopoles, patches and slots are described, followed by presentations on frequency reconfigurable antennas, pattern reconfigurable antennas, and basic scanning antenna arrays. Switch biasing in an electromagnetic environment is discussed, as well as simulation strategies of reconfigurable antennas, and MIMO (Multiple Input Multiple Output) reconfigurable antennas. Performance characterization of reconfigurable antennas is also presented. The book provides information for the technical professional to design frequency reconfigurable, pattern reconfigurable, and MIMO antennas all relevant for modern wireless communication systems. Readers learn how to select switching devices, bias them properly, and understand their role in the overall reconfigurable antenna design. The book presents practical experimental implementation issues, including losses due to switches, materials, and EMI (Electromagnetic Interference) and shows how to address those.

This book addresses one of the most overlooked practical, methodological, and moral questions in the journey to secure and handle the massive amount of data being generated from smart devices interactions: the integration of Blockchain with 5G-enabled IoT. After an overview, this book discusses open issues and challenges, which may hinder the growth of Blockchain technology. Then, this book presents a variety of perspectives on the most pressing questions in the field, such as: how IoT can connect billions of objects together; how the access control mechanisms in 5G-enabled industrial environment works; how to address the real-time and quality-of-service requirements for industrial applications; and how to ensure scalability and computing efficiency. Also, it includes a detailed discussions on the complexity of adoption of Blockchain for 5G-Enabled IoT and presents comparative case studies with respect to various performance evaluation metrics such as scalability, data management, standardization, interoperability and regulations, accessibility, human-factors engineering and interfaces, reliability, heterogeneity, and QoS requirements. This book acts as a professional guide for the practitioners in information security and related topics.

The demands of consumer electronic products to support multi-functionality such as computing, communication and multimedia applications with reduced form factor and low cost is the driving force behind packaging technologies such as System on Package (SOP). SOP aims to enhance the functionality of the package while providing form factor reduction by the integration of active and passive components. However, embedding components within mixed signal packages causes unwanted interferences across the digital and analog-radio frequency (RF) sections of the package, which is a major challenge yet to be addressed. This dissertation focused on the chip-last method of embedding chips within cavities in organic packages and addressed the challenges for preserving power integrity in such packages. The challenges associated with electromagnetic coupling in packages when chips are embedded within the substrate layers are identified, analyzed and demonstrated. The presence of the chip embedded within the package introduces new interaction mechanisms between the chip and package that have not been encountered in conventional packages with surface mounted chips. It is of significant importance to understand the chip-package interaction mechanisms, for ensuring satisfactory design of systems with embedded actives. The influence of the electromagnetic coupling from the package on the bulk substrate and bond-pads of the embedded chip are demonstrated. Solutions that remedy the noise coupling using Electromagnetic Band-Gap structures (EBGs) along with design methodologies for their efficient implementation in multilayer packages are proposed. This dissertation presents guidelines for designing efficient power distribution networks in multilayer packages with embedded chips.

The subject of this book is the fast-developing area of research known as metamaterials/metasurfaces and some of their engineering applications. This book comprehensively presents the state of the art of metamaterials/metasurfaces from theory to applications. The theoretical side includes electrodynamics of left-handed medium, generalized Snell's law, digital coding metamaterials/metasurfaces, group theory of metamaterials, information metamaterials and metasurfaces, etc. On the application side, a wide range of design examples are discussed, including metamaterial antennas, electromagnetic interference, frequency selective surfaces, wireless power transmission and energy harvesting, cloaking and radar cross section reduction, orbital angular momentum, wireless communication, imaging, etc. The book provides researchers, engineers, and graduate students with a variety of new discoveries, results, information, and knowledge in the field of metamaterials and metasurfaces.