Computer Simulation Of Warpage Formation In Injection Molding Of A Plastic Step Pad

This book covers a wide range of applications and uses of simulation and modeling techniques in polymer injection molding, filling a noticeable gap in the literature of design, manufacturing, and the use of plastics injection molding. The authors help readers solve problems in the advanced control, simulation, monitoring, and optimization of injection molding processes. The book provides a tool for researchers and engineers to calculate the mold filling, optimization of processing control, and quality estimation before prototype molding.

"Education, arts and social sciences, natural and technical sciences in the United States and Canada".

Given the importance of injection molding as a process as well as the simulation industry that supports it, there was a need for a book that deals solely with the modeling and simulation of injection molding. This book meets that need. The modeling and simulation details of filling, packing, residual stress, shrinkage, and warpage of amorphous, semi-crystalline, and fiber-filled materials are described. This book is essential for simulation software users, as well as for graduate students and researchers who are interested in enhancing simulation. And for the specialist, numerous appendices provide detailed information on the topics discussed in the chapters.

Injection molding is arguably the most successful area of modeling and simulation for any polymer forming process. This is demonstrated by the number of companies devoted to development of software for molding simulation. Despite this, there are no texts aimed at users of such software and those who wish to improve the performance of existing software. This book is intended as a description of modern molding simulation technology for users and researchers. The book tries to be self contained and provides the major technologies used and assumptions made by commercial codes so as to provide a guide to users of limitations and a basis for further development. In the latter part of the book some ideas and approaches for improving simulation technology are provided. These are specifically aimed at fiber filled and semi-crystalline materials.