Advanced Topics In Microsystem Technology

Microsystems technologies have found their way into an impressive variety of applications, from mobile phones, computers, and displays to smart grids, electric cars, and space shuttles. This multidisciplinary field of research extends the current capabilities of standard integrated circuits in terms of materials and designs and complements them by creating innovative components and smaller systems that require lower power consumption and display better performance. Novel Advances in Microsystems Technologies and their Applications delves into the state of the art and the applications of microsystems and microelectronics-related technologies. Featuring contributions by academic and industrial researchers from around the world, this book: Examines organic and flexible electronics, from polymer solar cell to flexible interconnects for the co-integration of micro-electromechanical systems (MEMS) with complementary metal oxide semiconductors (CMOS) Discusses imaging and display technologies, including MEMS technology in reflective displays, the fabrication of thin-film transistors on glass substrates, and new techniques to display and quickly transmit high-quality images Explores sensor technologies for sensing electrical currents and temperature, monitoring structural health and critical industrial processes, and more Covers biomedical microsystems, including biosensors, point-of-care devices, neural stimulation and recording, and ultra-low-power biomedical systems Written for researchers, engineers, and graduate students in electrical and biomedical engineering, this book reviews groundbreaking technology, trends, and applications in microelectronics. Its coverage of the latest research serves as a source of inspiration for anyone interested in further developing microsystems technologies and creating new applications.

Microsystems are an important success factor in the automobile industry. In order to fulfil the customers requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. With the international conference AMAA 2002, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.

Microsystems are an important success factor in the automobile industry. In order to fulfil the customers requests for safety convenience and vehicle economy, and to satisfy environmental requirements, microsystems are becoming indispensable. Thus a large number of microsystem applications came into the discussion. Some examples are sensors for engine management, exhaust and air quality control, immobilizers, ABS, anti skid (ASC) and vehicle dynamics control (VDC), smart airbag systems and other safety applications as obstacle detection and vision enhancement. With the international conference AMAA '98, VDI/VDE-IT provides a platform for the discussion of all MST relevant components for automotive applications. The conference proceedings gather the papers by authors from automobile suppliers and manufacturers.

Driven by the electronics industry, electrochemical technology has rapidly evolved, finding increasing applications in microelectronics, batteries, sensors, materials science, industrial fabrication, corrosion, microbiology, neurobiology and medicine. Electrochemical Microsystem Technologies provides an overview of the technological status; the dev

The 8th International Conference on Fracture (ICF8), held in Kyiv, Ukraine, attracted 550 delegates from 30 countries with over 700 papers presented. This volume contains a representative selection of 72 articles of the highest standard from internationally renowned experts in the field. Principal topics covered include: mechanics and criteria of fracture, stress-strain analysis in solids with cracks, physics and mechanics of fracture, dynamic fracture, environmental effects, temperature influence on fracture, advanced and special-purpose materials engineering applications of fracture mechanics, fracture mechanics and strength of welded joints and structures, testing techniques and failure diagnostics. For anyone working in fracture mechanics and the performance of materials, this volume provides a valuable snapshot of the major recent developments in the field.

This completely revised edition of a bestselling concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. The chapters on silicium and LIGA technology are greatly expanded, whilst new topics include application aspects in medicine and health technology, lithography and electroplating.

This concise introduction to microsystems technology includes the latest trends in this emerging scientific discipline. Completely revised, this edition has expanded chapters on silicium and LIGA technology as well as new topics.

This is the first compendium on silicon/glass microsystems made by deep wet etching and the first book with a detailed description of bonding techniques used in microsystem technology. Technological results presented in the book have been tested experimentally by the author and his team, and can be utilized in day-to-day laboratory practice. Special attention has been paid to the highest level of accessibility of the book by students.

MEMS technology is increasingly penetrating into our lives and improving our quality of life. In parallel to this, advances in nanotechnology and nanomaterials have been catalyzing the rise of NEMS. Consisting of nine chapters reviewing state-of-the-art technologies and their future trends, this book focuses on the latest development of devices and fabrication processes in the field of these extremely miniaturized electromechanical systems. The book offers new knowledge and insight into design, fabrication, and packaging, as well as solutions in these aspects for targeted applications, aiming to support scientists, engineers and academic trainees who are engaged in relevant research. In the chapters, practical issues and advances are discussed for flexible microdevices, bioMEMS, intelligent implants, optical MEMS, nanomachined structures and NEMS, and others. Most of the chapters also focus on novel fabrication/packaging processes, including silicon bulk micromachining, laser micromachining, nanolithography, and packaging for implantable microelectronics enabled by nanomaterials.