A One Semester Course In Modeling Of Vsli Interconnections

Quantitative understanding of the parasitic capacitances and inductances, and the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrated (VLSI) circuits has become extremely important for the optimum design of the state-of-the-art integrated circuits. More than 65 percent of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Mathematical techniques to model the parasitic capacitances, inductances, propagation delays, crosstalk noise, and electromigration-induced failure associated with the interconnections in the realistic high-density environment on a chip will be discussed. A One-Semester Course in Modeling of VLSI Interconnections also includes an overview of the future interconnection technologies for the nanotechnology circuits.

The optimum design of state-of-the-art integrated circuits relies heavily on quantitative understanding of the parasitic capacitances and inductances in the resultant propagation delays and crosstalk phenomena associated with the metallic interconnections on the very large scale integrate circuits (VSLI). This is because more than 65% of the delays on the integrated circuit chip occur in the interconnections and not in the transistors on the chip. Modeling of VSLI Interconnections will discuss the mathematical techniques necessary to model the parasitic capacitances, inductances, propagation delays, crosstalk noise and electro migration-induced failure associated with the interconnections in the realistic high-density environment on a chip. This book will be the first of its kind written for a one-semester course on the mathematical modeling of metallic interconnections on a VLSI circuit. In most institutions around the world, this course will be offered at an upper-level undergraduate and beginning graduate level. The book will also be of interest to practicing engineers in the field who are looking for a quick refresher on the subject.

Modeling and Simulation of High Speed VLSI Interconnects brings together in one place important contributions and state-of-the-art research results in this rapidly advancing area. Modeling and Simulation of High Speed VLSI Interconnects serves as an excellent reference, providing insight into some of the most important issues in the field.

This book presents an updated selection of the most representative contributions to the 2nd and 3rd IEEE Workshops on Signal Propagation on Interconnects (SPI) which were held in Travemtinde (Baltic See Side), Germany, May 13-15, 1998, and in Titisee-Neustadt (Black Forest), Germany, May 19-21, 1999. This publication addresses the need of developers and researchers in the field of VLSI chip and package design. It offers a survey of current problems regarding the influence of interconnect effects on the electrical performance of electronic circuits and suggests innovative solutions. In this sense the present book represents a continua tion and a supplement to the first book "Signal Propagation on Interconnects", Kluwer Academic Publishers, 1998. The papers in this book cover a wide area of research directions: Beneath the des cription of general trends they deal with the solution of signal integrity problems, the modeling of interconnects, parameter extraction using calculations and measurements and last but not least actual problems in the field of optical interconnects.

This Second Edition focuses on emerging topics and advances in the field of VLSI interconnections In the decade since High-Speed VLSI Interconnections was first published, several major developments have taken place in the field. Now, updated to reflect these advancements, this Second Edition includes new information on copper interconnections, nanotechnology circuit interconnects, electromigration in the copper interconnections, parasitic inductances, and RLC models for comprehensive analysis of interconnection delays and crosstalk. Each chapter is designed to exist independently or as a part of one coherent unit, and several appropriate exercises are provided at the end of each chapter, challenging the reader to gain further insight into the contents being discussed. Chapter subjects include: * Preliminary Concepts * Parasitic Resistances, Capacitances, and Inductances * Interconnection Delays * Crosstalk Analysis * Electromigration-Induced Failure Analysis * Future Interconnections High-Speed VLSI Interconnections, Second Edition is an indispensable reference for high-speed VLSI designers, RF circuit designers, and advanced students of electrical engineering.

In recent years, customer demands for higher speeds and smaller chips have resulted in the use of interconnections in multilevel and multilayer configurations. Various issues associated with very large scale integrated circuit (VLSIC) interconnections used for high-speed applications are emphasized. Written for those who want to gain a better understanding of the factors associated with modeling, analyzing and simulating high-density, high-speed interconnections, the chapters are designed so that they can be read independently.

Engineers have long been fascinated by how efficient and how fast biological neural networks are capable of performing such complex tasks as recognition. Such networks are capable of recognizing input data from any of the five senses with the necessary accuracy and speed to allow living creatures to survive. Machines which perform such complex tasks as recognition, with similar ac curacy and speed, were difficult to implement until the technological advances of VLSI circuits and systems in the late 1980's. Since then, the field of VLSI Artificial Neural Networks (ANNs) have witnessed an exponential growth and a new engineering discipline was born. Today, many engineering curriculums have included a course or more on the subject at the graduate or senior under graduate levels. Since the pioneering book by Carver Mead; "Analog VLSI and Neural Sys tems", Addison-Wesley, 1989; there were a number of excellent text and ref erence books on the subject, each dealing with one or two topics. This book attempts to present an integrated approach of a single research team to VLSI ANNs Engineering.